In a silver brazing process, why is more heat required for the copper part?

In silver brazing, the requirement for more heat in the copper part largely stems from its excellent thermal conductivity characteristics. Copper is known for its ability to conduct heat away quickly, which means that during the brazing process, the heat applied to the copper part can be dispersed rapidly throughout the material.

This necessitates providing additional heat to ensure that the soldering area reaches the appropriate temperature for the brazing filler metal to flow and bond effectively with the copper. If the heat introduced is not sufficient, the area being brazed may not achieve the necessary temperature, which could compromise the quality of the joint formed.

While it is true that various factors, such as bonding and thermal mass, play roles in brazing processes, the primary concern with copper is its ability to dissipate heat quickly. This helps clarify why the correct answer pertains specifically to its conductive properties, requiring more heat input during the brazing process to compensate for the rapid heat loss.